FLEXIBLE CONTINUOUS CATHODE CONTACT CIRCUIT FOR ELECTROLYTIC PLATING OF C4, TAB MICROBUMPS, AND ULTRA LARGE SCALE INTERCONNECTS

摘要

A cathode contact device (20) is provided for providing deposition onto a target surface (18) of a workpiece (16). The workpiece has a first electrically conductive continuous contact (17) surrounding the target surface (18). The cathode contact device (20) includes a second electrically conductive continuous contact adapted for frictionally contacting the first contact (17) along a continuous path located on the first contact (17). The second contact further has an inner periphery defining an aperture for passing therethrough the particles onto the target surface (18). Additionally, the cathode contact device (20) includes a circuit for electrically coupling the second contact to an electrical current supply (25).