发明名称 Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards
摘要 A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package, whereas the molding compound includes organic polymer fibers. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the organic polymer fibers includes at least one selected from the group consisting of cotton, cellulose, polyester and nylon. In another preferred embodiment, the portable peripheral card is a PCMCIA card. In another preferred embodiment, the filler includes silica and organic polymer fibers. Methods of manufacturing such peripheral cards are also disclosed.
申请公布号 US5617297(A) 申请公布日期 1997.04.01
申请号 US19950533118 申请日期 1995.09.25
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 LO, RANDY;TAKIAR, HEM P.
分类号 G06K19/077;H05K3/28;(IPC1-7):H05K1/14;H05K1/03 主分类号 G06K19/077
代理机构 代理人
主权项
地址