发明名称 RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent non-filling or the occurrence of voids positively by arranging a rotator to be rotated by flowing resin in the runner. SOLUTION: A void 22 included in resin 10 is pressed against the inner periphery of a recess 12 along the flow of resin 10, moreover, contracted in diameter through compression, and then traveled within the recess 12 by a rotator 13 and fed in a runner 5, further, it travels along its one inner wall. In this instance, since the inner pressure in the runner 5 to which resin 10 is fed from the recess 12 is reduced, the void 22 expands and enlarges in its area contacting the inner wall of the runner 5. On the other hand, a void collecting dummy cavity 20 communicates with the runner 5 at this part, so that the void 22 can be caught by the dummy cavity 20 with ease. Accordingly, resin including no void 22 is fed to cavities 6, 7 for resin molding, and thus resin molding can be done without voids.
申请公布号 JPH0985775(A) 申请公布日期 1997.03.31
申请号 JP19950247142 申请日期 1995.09.26
申请人 NEC KANSAI LTD 发明人 UCHIYAMA NORIHIRO
分类号 B29C45/26;B29C45/02;B29C45/14;B29C45/27;B29C45/30;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
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