NON-CONTACT IC CARD AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To fix an IC module to an upper lid or a lower lid for certainty without using an adhesive. SOLUTION: At least on one of two resin plates to be an upper lid 110 and a lower lid 120, an energy director and a first welding rib 150 formed of a protrusion are provided along an outer periphery. An energy direct section of the welding rib is fused by ultrasonic wave and the two resin plates are welded and fixed. At a position in an area of a loop antenna 131 of an IC module 130 where there is no antenna circuit, an energy director and a second welding rib 160 formed of a protrusion are provided and the energy direct section of the welding rib is fused by ultrasonic wave, and the two resin plates are welded and fixed. In the IC module, a through hole is provided at the position in the area of the loop antenna where there is no antenna circuit so as to fit to the second welding rib.