| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the contamination of a wafer with dust and the breakage, scratching, etc., of the wafer by providing tweezers which are connected to a first vacuum line on one end side and which a sucking means through a connector installed in a manufacturing device on the other end side and have a body composed of a second vacuum line installed in the manufacturing device. SOLUTION: When the user of a semiconductor manufacturing device 400 opens a valve 52, the vacuum supplied to a first vacuum line 55A is supplied to a connector 57 through a second vacuum line 55B installed in the device 400. When the user further connects vacuum tweezers 60 to the connector 57, the vacuum is supplied to the vacuum hole 62 of the tweezers 60. When the hole 62 of the tweezers 60 is brought into contact with the surface of a wafer, the wafer is stuck to the tweezers 60 by suction. Therefore, the conventional contamination of the wafer with dust caused by an electrostatic phenomenon is reduced and the breakage and scratching of the wafer caused by the interruption of the vacuum which occurs when the vacuum line is twisted or trod down can be minimized.</p> |
