| 摘要 |
PROBLEM TO BE SOLVED: To set outer terminals extending from the lower opening of the connection holes of a board as high as prescribed and uniform in height, enhanced in reliability, and formed through a simpler process by a method wherein a solder rod is inserted into the connection holes of the board, and the protruding part of the solder rod from the second main surface of the board is made to serve as an outer terminal. SOLUTION: A semiconductor device 1 is mounted on a first main surface 31 of a board 2, and an outer terminal 10 is made protrude from the second main surface of the board 2. A conductive wiring 6 and an outer terminal 10 are electrically connected to a connection through-hole 7 or a connection half hole provided to the board 2 through a connecting means. A solder rod 9 is made to protrude continuously from the second main surface 32 of the board 2 through the connection through-hole 7 to serve as an outer terminal 10. The tip of the outer terminal 10 is kept unchanged in shape when it is cut and not formed into a hemisphere which appears when solder is fused. By this setup, the outer terminal 10 can be mounted without being thermally treated and cleaned, so that a device of high quality can be realized. |
