| 摘要 |
PROBLEM TO BE SOLVED: To prevent the flow of solder into the wire bonding area without causing higher cost. SOLUTION: Flow stoppers 2a and 2b of the edge part 2 of a pressure plate are pressed with constant pressure on the wire bonding area 7a and 7b covering all surfaces on the surface of an element mounting member 7 and interrupt the gold solder, melted and flowing out, from flowing into the wire bonding area 7a and 7b. A solder drains 2c makes the melted gold solder 13 flowing out towards the wire bonding area 7a and 7b, flow out to the region outside the wire bonding area 7a and 7b. |
