| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid the scattering of sealing member by the internal pressure for adhering to an outer lead terminal, etc., when a semiconductor element is airtightly contained inside a container made of an insulating substrate and a cover body. SOLUTION: In the title semiconductor element containing package having a mounting part 1a mounting semiconductor element on the upper surface, an insulating substrate 1 whereon the first frame type metallized layer 9 coat- formed to encircle the mounting part 1a as well as a cover body 2 having a second frame type metallized layer 10 coated with a sealing member 8 made of a wax material on the lower surface, the first metallized layer 9 on the insulating substrate 1 and the second metallized layer 10 on the cover body 2 are joined via sealing member 8 coating the second metallized layer 10 of the cover body 2 thereby enabling the semiconductor element to be airtightly contained inside the container 4 made of the insulating substrate 1 and the cover body 2, the second metallized layer 10 of the cover body 2 is double layer-structured of an inside frame 10a and an outside frame 10b.</p> |
