EPOXY RESIN COMPOSITION FOR ELECTROLAMINATES HAVING ARYL SUBSTITUTED GUANIDINE AND/OR BIGUANIDE AS CROSS-LINKING AGENT

摘要

The present invention pertains to a bromine-containing epoxy resin composition for printed wiring board substrates, i.e., for electrolaminates. The present invention provides a bromine-containing epoxy resin composition where the use of dicy as cross-linking agent is avoided and environmentally acceptable solvents such as acetone and methylethyl ketone can be employed. When liquid bromine-containing epoxy resins are employed, additional solvents can in fact be avoided altogether (this gives so-called solvent-free resin compositions). The epoxy resin composition according to the invention comprises: bromine-containing epoxy resin; aryl substituted guanidine or biguanide as cross-linking agent; optionally, epoxy resin not containing bromine; optionally, a catalyst and; optionally methylethyl ketone or acetone as a solvent, no additional solvents being present. Particular preference is given to the use of diphenyl guanidine and o-tolyl biguanide as cross-linking agents. The invention is also aimed at electrolaminates comprising the resin composition according to the invention.