发明名称 METHOD AND DEVICE FOR TREATING HOLES OR RECESSES EXTENDING INTO WORKPIECES WITH LIQUID TREATMENT MEDIA
摘要 Treating, for example cleaning, holes or recesses in workpieces is problematic when the holes or recesses are less than 0.5 mm wide, and in particular when they do not extend through the workpiece (blind holes). Known processes do not allow gas bubbles that adhere to the side walls of such holes to be removed nor liquids inside the holes to be effectively exchanged. The disclosed process allows the liquid inside the hole to be effectively exchanged by the liquid outside the holes. For that purpose, the liquid treatment medium is injected into the holes as a jet with a smaller diameter than the holes. Also disclosed is a device for carrying out this process with a nozzle with one or more outlets of less than 0.5 mm diameter, a liquid supply unit for pumping liquid treatment medium through the nozzle outlets, and a filtering unit in communication with the outlets and the supply unit for removing particles from the treatment medium.
申请公布号 CA2229023(A1) 申请公布日期 1997.03.27
申请号 CA19962229023 申请日期 1996.09.06
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 BRENN, GUENTER;SCH FER, MICHAEL;DURST, FRANZ;STREUP, HERIBERT;MEYER, HEINRICH
分类号 B05D3/10;B08B3/02;B08B3/08;C25D5/08;C25D7/00;H05K3/00;H05K3/26;(IPC1-7):B08B3/00;H05K3/42 主分类号 B05D3/10
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