发明名称 |
MICROELECTRONIC LEAD STRUCTURES WITH DIELECTRIC LAYERS |
摘要 |
A microelectronic connection component (62) has flexible leads (36) formed by polymeric strips (46, 50) with metallic conductors thereon. The metallic conductors (46, 50) may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip (46 or 50) may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip (62) or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk. |
申请公布号 |
WO9711588(A1) |
申请公布日期 |
1997.03.27 |
申请号 |
WO1996US14965 |
申请日期 |
1996.09.18 |
申请人 |
TESSERA, INC. |
发明人 |
FJELSTAD, JOSEPH;SMITH, JOHN, W. |
分类号 |
H05K1/18;H01L21/60;H01L23/31;H01L23/495;H01R12/04 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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