| 摘要 |
A workpiece handling arrangement comprises a first workpiece handling means (20) rotatably mounted on a first shaft (44) and a second workpiece handling means (20) rotatably mounted on a second shaft (46). The first shaft (44) is preferably hollow and defines an outer shaft, the workpiece handling means (20) are capable of independent relative movement and are connected to separate motors. The workpiece handling means can include grippers (14) for gripping workpieces such as semiconductor wafers (12). The first shaft (44) is preferably hollow and defines an outer shaft, the second shaft (46) being arranged concentrically within the outer shaft so that the outer shaft rotatably supports the inner shaft. Typically, the inner shaft is also a hollow shaft.
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