发明名称 WIRING BOARD AND SEMICONDUCTOR ELEMENT KEEPING PACKAGE WITH THIS WIRING BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To obtain a package capable of maintaining a connected state to an external electric circuit board over a long period of time by mixing a lithium silicate glass containing a specific amount of Li2 O and having a yield point in a specific temperature range with forsterite and quartz as essential components by a specific ratio, and performing sintering. SOLUTION: As an insulating board 1 for an element housing package A, a molding containing 20-80vol.% of lithium silicate glass containing 5-30wt.% of Li2 O and having a yield point of 400-800 deg.C 20-80vol.% by the total amount of forsterite and quartz as a filler component is sintered to manufacture a board. Consequently, it becomes possible to obtain a sintered body having a thermal expansion coefficient of 8-18ppm/ deg.C in a temperature range of 40-400 deg.C, and to lighten the generation to thermal stress between the body and an external electric circuit board B and to maintain an excellent connection over a long period of time.
申请公布号 JPH0974153(A) 申请公布日期 1997.03.18
申请号 JP19950253439 申请日期 1995.09.29
申请人 KYOCERA CORP 发明人 HAMADA NORIAKI;YAMAGUCHI KOICHI;YONEKURA HIDETO;TAMI YASUHIDE;AZUMA MASAHIKO;FURUKUBO YOJI
分类号 H01L23/14;H01L23/15 主分类号 H01L23/14
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