| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent plating metal from being anomally deposited by a method wherein an alkali releasable dry film is pasted so as to cover an electronic element housing part after a through-hole is formed, a part of the dry film confronting the through-hole is removed, a metal film is formed by plating, the dry film is removed from the electronic element housing section, and a gold film is formed. SOLUTION: Both the sides of a multilayered board 15 are coated with an alkali releasable dry film 8 so as to cover an electronic element housing section 2 and through-holes 3, a part of the dry film 8 confronting the through-holes 3 is removed by exposure and development. A part of the dry film 8 which covers the electronic element housing section 2 is left unremoved. Colloidal carbon is given as plating catalyst 6 into the through-holes 3. The through-holes 3 are subjected to an electrolytic copper plating process for the formation of a metal film 9. A nickel film is deposited on the metal film 9 through an electrolytic nickel plating process, and then a gold film is deposited through electrolytic plating so as to obtain the formation of a multilayer printed wiring board. Therefore, nickel or gold can be prevented from being anomally deposited between conductor circuits exposed inside the electronic element housing section 2.</p> |
