SEMICONDUCTOR DEVICE, WIRING BOARD, AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To control characteristics of a high-frequency module accurately at low cost, in which the impedance is controllable constantly with small impedance at a bump and no fear of a malfunction caused by unconformity in impedance. SOLUTION: A semiconductor device includes a wiring board 11 with an electrode wiring layer 4, and a plurality of semiconductor elements 7 with an electrode pad 8 connected through a bump 6 on the wiring layer 4. The bump 6 is made of material harder than the wiring layer 4, and the bump 6 is subjected to press fitting to the wiring layer 4 with the semiconductor device 7 under pressure.