发明名称 STRUCTURE FOR MOUNTING HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a structure for mounting a heat sink which allows heat of a source of heat to be exhausted outside a board without applying the heat to an electronic apparatus, etc., in a control board which houses the source of heat and the electronic apparatus, etc., in it. SOLUTION: A control board consists of a chassis 5, a case, etc. Wiring apparatuses and control devices are installed on the chassis 5. A source of heat is installed in the control board. A heat sink 3 for dissipating heat from the source of heat outside the control board is installed outside the control board. Between the heat sink 3 and the control board, a space A is formed.
申请公布号 JPH0974623(A) 申请公布日期 1997.03.18
申请号 JP19950246972 申请日期 1995.08.31
申请人 EBARA CORP 发明人 TAKADA TSUTOMU;KAWAGUCHI HITOSHI;SHIMIZU SUSUMU
分类号 H02B1/56 主分类号 H02B1/56
代理机构 代理人
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