| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to efficiently manufacture, for example, a thin multilayer printed circuit board with high yield without reducing the heat resistance and moldability by specifying the thicknesses of the insulating layer of the laminated board for constituting a laminate and the resin layer of a resin- coated copper foil. SOLUTION: Laminated boards 1, resin coated copper foils 2 and, as required, a prepreg 3 are superposed between opposed upper and lower molds disposed on the upper surface of a platen, and a laminate is laid up. Then, the laminate laid up between the upper and lower molds is sealed by a vacuum bag. Thereafter, the bag is conveyed into a pressure oven, and sealed in the oven. Subsequently, the bag is evacuated, an inert gas is supplied into the oven, the laminate is pressurized, and the gas is heated to heat the laminate. In this case, the boards 1 for constituting the laminate each has a thickness of 0.2mm or less, The foil has the thickness of 35μm or less, and the resin layer has a thickness of 0.04 to 0.2mm, and these boards 1 and the foils with the layer are used.</p> |
