PROCESS AND DEVICE FOR TESTING A CHIP

摘要

A process and device for testing substrates with a printed circuit structure, especially chips (21). An electrical check on the printed circuit structure of the substrate (21) is made during the transfer of the solder deposits (28) by means of a solder deposit substrate (25) having a structured electrically conductive coating (12) with terminal surfaces (17) for the arrangement of solder deposits (28) and their transfer to correspondingly arranged terminal surfaces (22) of a substrate (21).