| 发明名称 |
Testing semiconductor elements |
| 摘要 |
<p>Protruding electrodes 12 are formed on a test substrate 10 having test wires 10a. Electrical connection electrodes 3a of an unpackaged semiconductor element 3 are bonded to the protruding electrodes 12. After the element 3 has been tested in a heated atmosphere, the element 3 is removed from the test substrate 10, taking with it the electrodes 12, which are more strongly bonded to the electrodes 3a than to the test substrate 10.</p> |
| 申请公布号 |
GB2301938(B) |
申请公布日期 |
1997.03.12 |
| 申请号 |
GB19960014327 |
申请日期 |
1995.02.21 |
| 申请人 |
* MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TSUNEO * HAMAGUCHI;KENJI * KAGATA;GORO * IZUTA;MITSUNORI * ISHIZAKI;OSAMU * HAYASHI;SUSUMU * HOSHINOUCHI |
| 分类号 |
G01R1/04;G01R31/28;H01L21/60;H01L23/544;H01L25/065;(IPC1-7):H01L21/60;H01L21/66 |
主分类号 |
G01R1/04 |
| 代理机构 |
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代理人 |
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