| 摘要 |
1,079,399. Semi-conductor devices. I. T. T. INDUSTRIES Inc. June 1, 1966 [June 1, 1965], No. 24439/66. Heading H1K. In manufacturing a plurality of semi-conductor devices each device is mounted on a selected lead of a group of leads extending from a conductive strip and at least one electrode of the device is electrically connected to another of the group of leads. The devices are then encapsulated and the leads severed from the strip. The leads may be formed integral with the strip or welded or soldered to it. Encapsulation is effected either by immersion in a resin solution or low melting glass or by die-casting or injection moulding. |
