| 摘要 |
PURPOSE:To assure required performances and to improve productivity and reliability, by arranging elements comprising bare semiconductor devices in the order of a sensor, a signal processor and an output pins, and overcoating the sensor and the signal processor with the same resin. CONSTITUTION:On a substrate 1, a sensor (bare PIN photodiode) 2, a signal processor (bare IC) 3 and an output picking pin B are arranged in one line in that order. The two bare semiconductors (the sensor 2 and the signal processor 3) are overcoated with a same resin 6. In this way, the IC and the PIN diode are arranged within a short distance, and the IC and the PIN diode are coated with the same resin in this arrangement. Therefore, the productivity and the reliability of the device can be enhanced. |
