| 摘要 |
PROBLEM TO BE SOLVED: To prevent electrical characteristics from deteriorating due to the increase in the junction temperature of a semiconductor chip caused by the conduction of a semiconductor chip mounted on a semiconductor device. SOLUTION: A semiconductor chip 1 is mounted on a heat sink 2 in a semiconductor device 21 and further the heat sink 2 is connected to a PWM cooling layer 6 in a printed wiring board 4 via a cooling boss 5, thus efficiently radiating heat which is generated due to the conduction of the semiconductor chip 1 into the semiconductor device 21. |
