| 摘要 |
PROBLEM TO BE SOLVED: To obtain a hot-melt resin composition for the heat-sealing of a substrate by hot-melt method, capable of getting high adhesive force without using a tackifier and maintaining various characteristics such as odor, ready openability, hot oil resistance and processability to satisfiable levels. SOLUTION: This hot-melt resin composition contains, as resin components, (A) 100 pts.wt. of an ethylenic resin other than the component B and (B) 25-400 pts.wt. of an ethylene-α-olefin copolymer having a melt-flow rate of 0.5-100g/10min, a density of 0.86-0.88g/cm<3> and a maximum melting peak temperature of <110 deg.C measured by a differential scanning calorimeter.
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