| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be effectively made thin and miniaturized, has improved heat dissipation property, and at the same time is suited for achieving multiple pins. SOLUTION: A semiconductor element 20 is electrically connected to a wiring pattern 12 of a flexible wiring substrate 10 where a wiring pattern 12 is provided, at the same time the element mounting region of the flexible wiring substrate 10 where the semiconductor element 20 is mounted is sealed by resin to form a resin sealing part 22, the flexible wiring substrate 10 at an area other than the element mounting region is folded back and is joined to the upper surface of the resin sealing part 22, and an external connection terminal 8 which continues to the wiring pattern 12 is connected the flexible wiring substrate 10 which is folded back and is joined to the upper surface of the resin sealing part 22.</p> |
