| 摘要 |
PROBLEM TO BE SOLVED: To reduce consumption of chemical and ultrapure water while keeping the cleaning efficiency on the same order as that of a dip type cleaning equipment and to prevent recontamination or staining due to chemical. SOLUTION: The cleaning/etching/drying system for semiconductor wafer comprises a process chamber 1 constructed such that the temperature in an enclosed space 2 can be regulated by means of a heater 3, a mesh 4 disposed in the center of chamber 1 in order to support one or a plurality of wafers 5 to be cleaned, a plurality of spray nozzles 7 arranged in line at the upper part in chamber, and a rotary delivery nozzle 8 disposed at the lower part in chamber. Chemical and ultrapure water are sprayed, along with nitrogen gas, from the spray nozzles 7 while chemical and ultrapure water are ejected, in the form of jet water flow, from the delivery nozzle through a revolution arm 12 and rotation arm 14.
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