发明名称 Method for forming electrode on semiconductor
摘要 A method for forming electrodes on a semiconductor includes introducing at least one reactive oxidizing gas selected from the group consisting of ozone, atomic oxygen, nitrogen dioxide, oxygen ion and oxygen plasma to an oxide semiconductor surface and depositing electrode material on the oxide semiconductor surface without exposing the surface to the outside atmosphere.
申请公布号 US5610097(A) 申请公布日期 1997.03.11
申请号 US19960615106 申请日期 1996.03.14
申请人 AGENCY OF INDUSTRIAL SCIENCE & TECHNOLOGY, MINISTRY OF INTERNATIONAL TRADE & INDUSTRY 发明人 SHIMIZU, TAKASHI
分类号 C23C14/24;H01L21/203;H01L21/285;H01L21/3205;H01L29/47;H01L29/872;(IPC1-7):H01L21/44 主分类号 C23C14/24
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