| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor laser device of small displacement of light emitting point against environment temperature change or under high temperature and high humidity for a long time, which is suitable for an optical application device. SOLUTION: This semiconductor laser device has a plurality of fixing end parts E connected in one piece structure, seals metallic main post 5m whereto the laser diode chip 1 and a monitor photodiode are fixed and metallic auxiliary post 5s and the laser diode chip 1 and mainly comprises light transmitting sealing resin 9 which fixes the posts 5m, 5s mutually and a metallic base 40 for fixing an entire of a semiconductor laser device to other devices. The fixing end part E projects form the sealing resin 9 and the fixing end part E is fixed to a groove 4g provided in the metallic base 40. As for the fixing method of the fixing end part E to a metallic base, calking (calking marks K1, K2), soldering or spot welding are suitable.</p> |
