| 摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize a device by rotatably mounting a pair of guide rails guiding both side end sections of a wafer ring in the vertical direction centering around the wafer-ring cassette side. SOLUTION: A pair of guide rails 69, 70 guiding both side end sections of a wafer ring 1 carried by a wafer-ring carrying means 35 are installed rotatably in the vertical direction centering around the wafer-ring cassette 10 side. When the wafer ring 1 is carried, the members 69a, 70a of the guide rails 69, 70 are rotated so as to be made level. Consequently, the members 69a, 70a are tuned at the time of the pickup operation of semiconductor pellets 3 by a pellet pickup device 20, and a section between the wafer-ring cassette 10 and a wafer-ring support ring 24 is brought to the state, in which it is spread widely. Accordingly, the pellet pickup device 20 can be moved in the XY directions at a place near to the wafer-ring cassette 10, thus miniaturizing a device.</p> |
