| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor devices almost of the same size as that of a chip which can be sealed by transfer molding as the semiconductor devices of the prior art and manufacture a number of semiconductors by single molding. SOLUTION: A lead frame with a series of the same components is fixed to a semiconductor element 1, the electrodes 2 of the semiconductor element 1 are connected to leads 3 electrically, recessed parts are formed on the surface of a package by adhering a resin board 8, which is formed with through holes 9 that accommodate external terminals, on the other side of the fixing surface of the leads 3 to the semiconductor element 1, the semiconductor element is held by the lead frame inside the metal dies, the package is formed by resin sealing so that the resin board is exposed from the surface of the resin package and external terminals 6 are provided on the recessed part. With this, the mass production of the semiconductor devices by a conventional manufacturing facility is enabled, the moisture resistance of the semiconductor devices is improved as the semiconductor element surfaces are not exposed and the chip size packages(CSP) are provided which can prevent an increase in manufacturing cost.
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