| 摘要 |
1,145,155. Soldering. ASSOCIATED SEMICONDUCTOR MFRS. Ltd. 6 Oct., 1966 [17 Feb., 1966], No. 6992/66. Heading B3R. In soldering wires 4 to a conductive pattern carried on a substrate 6 the wires are located above pads 5 of conductive material on the substrate and a continuous strip of solder 3 is provided between the wires and the pads, a jet of heated gas and the solder strip are moved relatively to one another to melt the solder strip which when melted moves across the surface of the substrate and remains at the contact points between the wires and pads. The tinned copper wires are urged by a jig, which also holds the glass substrate, into contact with the flattened flux cored eutectic solder 3 above gold pads 5 and air heated to 330‹ C. is blown from the nozzle 2 of a pipe 1 on to the strip. The hot air melts the solder to form beads 7 which move in turn across the substrate as the nozzle moves over the strip. Wires may be connected to printed wiring on an insulating board or to an integrated circuit on a semiconductor substrate which latter may be refrigerated to prevent damage by over heating. The substrate may be pre-heated. The gas may be hydrogen, nitrogen or a mixture of gases not containing oxygen. If the gold pads are not evenly spaced dummy wires may be positioned along the strip to gather excess solder and the nozzle may be held stationary while the substrate is moved. |
