SPUTTER TARGET/BACKING PLATE ASSEMBLY AND METHOD OF MAKING SAME

摘要

A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target (16) fabricated from a first material having a coefficient of thermal expansion; providing a backing plate (12) fabricated from a second material having a coefficient of thermal expansion; providing a block (20) fabricated from a third material having a coefficient of thermal expansion; positioning the block (20) on one side of the backing plate (12); positioning the target (16) on the other side of the backing plate (12); and subjecting the target (16), backing plate (12) and block (20) to elevated temperature and pressure to bond the target (16), backing plate (12) and block (20) together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.