发明名称 LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame which protects an outer lead against deformation caused by shrinkage in resin on curing after it is sealed up with resin. SOLUTION: A lead frame 8 is equipped with a frame 7, a die pad 1, outer leads 4, dam bars 5 whose both ends are supported at the frame 7, and suspension leads 2 linked to the frame 7 extending at an angle to the dam bars 5, wherein a long and thin slit 6 is provided to the frame 7 at a spot near each end of the dam bars 5 extending vertical to the lengthwise direction of the dam bar 5 and keeping a dam bar support 10 which traverses the dam bar 5 crosswise keeping unremoved.
申请公布号 JPH0955465(A) 申请公布日期 1997.02.25
申请号 JP19950208915 申请日期 1995.08.16
申请人 NEC CORP 发明人 SUZUKI YASUHIRO
分类号 H01L23/50;H01L23/495;(IPC1-7):H01L23/50 主分类号 H01L23/50
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