发明名称 BONDING WIRE FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent attachment and transfer to a capillary and a clamper by forming a coating layer comprising organic compound having the composition for specifying the weight of nitrogen on the surface of the thin wire of gold or a gold alloy. SOLUTION: Water-soluble wire drawing oil, whose main component is fatty acid ester, is used, and cast gold ingot undergoes wire drawing by using a diamond die. Thus, a piece of gold thin wire 1 is manufactured. A fatty acid ester film is formed on the gold thin wire 1. Furthermore, the organic compound having the composition, wherein the ratio of the weight of nitrogen with respect to the weight of carbon is 0.1-0.9, is prepared. The organic compound is dissolved into pure water, and the aqueous solution of the organic compound is formed. Then, the gold thin wire 1, on which the fatty acid ester film is formed, is made to pass through a tubular furnace 3 and annealed. Thereafter, the gold thin wire is made to pass through the aqueous solution of the organic compound in a coating tank 4 and further pass through a drying furnace 6. Thus, the water content is removed, and the thick coating layer is formed.
申请公布号 JPH0955396(A) 申请公布日期 1997.02.25
申请号 JP19950225731 申请日期 1995.08.10
申请人 MITSUBISHI MATERIALS CORP 发明人 MORIKAWA MASAKI;UCHIYAMA NAOKI;OOMURA TOSHIMASA
分类号 H01L21/60 主分类号 H01L21/60
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