发明名称 Process for making low-leakage contacts
摘要 A semiconductor device having low-leakage borderless contacts is formed by etching contact openings adjacent first and second electronic elements of opposite dopant type, conformally depositing a thin doped polysilicon layer, protecting the electronic element of similar dopant-type, removing the thin doped polysilicon layer adjacent the oppositely doped electronic element, diffusing dopant from said polysilicon layer into a side wall of the electronic element of similar dopant-type, and then depositing tungsten within the contact openings.
申请公布号 US5605862(A) 申请公布日期 1997.02.25
申请号 US19950417326 申请日期 1995.04.05
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GIVENS, JOHN H.;KOBURGER, III, CHARLES W.;LASKY, JEROME B.
分类号 H01L21/28;H01L21/60;H01L21/768;H01L23/48;H01L23/485;(IPC1-7):H01L21/44 主分类号 H01L21/28
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