发明名称 |
Process for making low-leakage contacts |
摘要 |
A semiconductor device having low-leakage borderless contacts is formed by etching contact openings adjacent first and second electronic elements of opposite dopant type, conformally depositing a thin doped polysilicon layer, protecting the electronic element of similar dopant-type, removing the thin doped polysilicon layer adjacent the oppositely doped electronic element, diffusing dopant from said polysilicon layer into a side wall of the electronic element of similar dopant-type, and then depositing tungsten within the contact openings.
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申请公布号 |
US5605862(A) |
申请公布日期 |
1997.02.25 |
申请号 |
US19950417326 |
申请日期 |
1995.04.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GIVENS, JOHN H.;KOBURGER, III, CHARLES W.;LASKY, JEROME B. |
分类号 |
H01L21/28;H01L21/60;H01L21/768;H01L23/48;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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