| 摘要 |
PROBLEM TO BE SOLVED: To form a resin-encapsulated material of a structure, wherein while the heat dissipation property of the encapsulation material is enhanced, a resin, which flows evenly and uniformly as designed. SOLUTION: A lead frame 3 is provided with lead parts and a frame part for supporting an element mounting part 5, the part 5 has a first region for placing a semiconductor chip 1 in its center part, a plurality of resin circulating holes 9 are made through the peripheral parts of the first region, the part 5 has a second region formed with a plurality of heat conduction paths, the size of this part 5 is substantially equal to that of a tape carrier 8 arranged on the part 5 and heat generated from the element 1 is dissipated to the outside through the heat conduction paths. The heat resistance of a resin-encapsulated semiconductor device can be reduced without changing the size of a package and at the same time, the unfilling of a molding resin and the deformation of a TAB tape can be prevented from being generated. |
