发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the detection rate of faulty places of a semiconductor device, and to locate the defective place in a short period of time. SOLUTION: A mark, to be left on a defective place, is put on by degenerating the reacting material formed on a semiconductor board by the energy coming from the defective place generated by the application of voltage to a semiconductor device. A polysilicon wiring 15, which is covered by an interlayer insulating film 14 through an insulating film, is formed on a semiconductor board 1. Negative resist is applied to the above-mentioned interlayer insulating film 14. Voltage is applied to the semiconductor board 1 in the above-mentioned state. The concentration of an electric field is generated when there is a faulty connection between the wiring and the semiconductor board, and a light 9 is emitted. The photoresist 10 reacts this light-emitting phenominon 9, and the photoresist 10 is exposed to light. When the photoresist 10 which is partially exposed to light, is developed and the part which is not exposed to light is removed, a photoresist mark 16, which is exposed to light and shows the diffective place, can be formed.
申请公布号 JPH0955408(A) 申请公布日期 1997.02.25
申请号 JP19950228628 申请日期 1995.08.15
申请人 TOSHIBA CORP 发明人 NODA TOMONOBU
分类号 H01L21/66;H01L21/027;H01L21/302;H01L21/3065;H01L33/30;H01L33/44 主分类号 H01L21/66
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