| 摘要 |
PROBLEM TO BE SOLVED: To suppress irregularities on the surface by laminating a thick conductor pattern and a prepreg pattern having a prepreg to be fitted in the cavity in combination. SOLUTION: A thick conductor pattern 1 having a thick conductor 1a formed into a required circuit pattern is combined with a prepreg pattern 5 having a prepreg 5a to be fitted in the cavity. It is then applied, on one or both sides with a prepreg sheet 2 and hot pressed. For example, the thick conductor pattern 1 comprises a thick conductor 1a punched or cut from a copper plate into a desired circuit pattern, a surrounding fringe frame 1c, and a conductor bridge 1b formed between adjacent thick conductors 1a and between the thick conductor 1a and the fringe frame 1c, formed integrally. |
