LITHOGRAPHIC SURFACE OR THIN LAYER MODIFICATION

摘要

A process for producing lithographic features in a substrate layer is described, comprising the steps of lowering a stamp (15) carrying a reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a patterm. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.