Chip module for chip card used as telephone or identification card

摘要

The chip module has a metal structure (MS1) etched in a metal plate, with planar contact surfaces (KF) at its front surface, for external contact with the chip module and raised chip contacts (CK1,CK2) at the rear. The chip contacts cooperate with respective chip terminals of a semiconductor chip (C1) at the rear of the metal structure, each chip contact lying within the area of the associated contact surface. Pref. the chip contacts cooperate directly with the chip terminals via flip-chip contacts, or are provided via a flip-chip adhesive or a flip-chip solder layer.