Method of encapsulating a chipcard module and device for performing the method

摘要

A chip-card or 'smart' card module (M) has a non-metallic carrier (C) with a contract surface (9) on the underside and an IC module (6) mounted on the top. Connections (7) are made with contact points on the card. The IC module is embedded with a protective deposition of synthetic material (1) that is provided by a dispenser (5) with a controlled nozzle (5a) and forms a dome shaped covering. The card is secured on a table (3) during the operation and this has channels (11) for suction to be applied. The centre of the table is cut away (2a) and provides a location for a UV lamp (4) used to harden the material.