发明名称 |
PROCESS FOR FLIP-CHIP CONNECTION OF A SEMICONDUCTOR CHIP |
摘要 |
A process for flip-chip connection comprises the steps of forming a plurality of spacer bumps 9 on the periphery of the semiconductor chip 6, forming a plurality of solder bumps 5 on the main chip surface, providing a cutting groove 10 between the solder bumps 5 and the spacer 9, aligning the solder bumps 5 on the semiconductor chip with the corresponding solder bumps on the circuit board 7, heating the assembly in order to merge the mating solder bumps 5 and thus to form the flip-chip connection, and breaking away the outer peripheral portion of the semiconductor chip 6 along the cutting groove 10 thereby removing the spacer bumps 9. <IMAGE>
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申请公布号 |
KR970001928(B1) |
申请公布日期 |
1997.02.19 |
申请号 |
KR19920016258 |
申请日期 |
1992.09.07 |
申请人 |
FUJITSU KK. |
发明人 |
NAKANISHI, TERU;KARASAWA, KAZUAKI;OCHIAI, MASAYUKI;HASHIMOTO, KAORU |
分类号 |
H01L21/60;H05K3/30;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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