发明名称 Method for supplying a polishing liquid and polishing method using the same
摘要 The invention provides a novel method of supplying a polishing liquid onto a surface of a polishing pad with which a surface of a film is polished wherein a solution including an aggregation agent and a slurry into which fine polishing particles were already dispersed are separately supplied onto the polishing surface so that the slurry is mixed with the solution to thereby cause an aggregation of the fine polishing particles to form aggregated particles to be used for polishing.
申请公布号 US5603654(A) 申请公布日期 1997.02.18
申请号 US19950387167 申请日期 1995.02.13
申请人 NEC CORPORATION 发明人 HAYASHI, YOSHIHIRO
分类号 B24B37/00;B24B57/00;C09K3/14;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B37/00
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