| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a bonding tool and pre-alignment jig from being damaged if both interfere, by removing a means for holding this jig. SOLUTION: A chip positioner 8 on a bonding apparatus is constituted as follows: 1) this apparatus is constituted so as to position a chip held by a bonding tool from above, 2) a chip positioning plane is formed on the inner side face of a pre-alignment jig 10 having a chip positioning face at the inner side wall is slidably mounted on a base 11, and 3) a position holding means which is removable by the interference between the bonding tool and jig 10 is disposed between the jig 10 and base 11.</p> |
