| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which can prevent the adhesion of a heat sink to a metal substrate from being marred by a step between a resin case and the substrate and enhance the adhesion to bring out effectively the heat disspation property. SOLUTION: A resin-sealed semiconductor device has a structure wherein power semiconductor elements 2 and an integrated circuit element 3 for control, which are mounted on a metal substrate 1 and are connected with each other through fine metal wires 4, are surrounded with a resin case 5, housed in the case 5, and sealed with sealing resin 6, and notch parts 13 are respectively formed in each mounting part 9 of the case 5 as deformable regions. Even in the case where a step is generated between the case 5 and the substrated 1 by these notch parts 13, the step is relaxed by the deformation of the substrate 1 by deforming the substrate 1 at the places of the notch parts 13, where the thickness of the resin becomes thin when the substrate 1 is mounted to a heat sink 8 with bolts 11 or screws, and the substrate 1 can be made to bond and fix on the heat sink 8 as it keeps a flatness. As a result, the dissipation of heat to the heat sink 8 is effectively conducted. |
