发明名称 SUBSTRATE TREATMENT DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate treatment device which can correctly adjust the temperature on the surface of a substrate supporting plate. SOLUTION: A thermal sensor 50 which is embedded in a heating plate 40 for a bake unit is embedded in a hole mode as being directed from the side wall to the central part of the plate 40. The thermal sensor 50 has a structure comprising a thermistor 50b being inserted into a guard tubing 50a, thermal conductive cement filling the gap and an element 50b being fixed at the terminal of the guard tubing 50a. The element 50b is arranged near the portion just under an upper face 40a of the hot plate 40. The longitudinal direction of the element 50b is arranged in the state of being almost parallel with the upper face 40a of the plate 40 and the distances from the upper face 40a to each part of the element 50b are kept constant. Therefore accuracy, response and so on are improved when the temperature of the upper face 40a of the plate 40 is measured, and the thermal adjustment of the upper face 40a of the plate 40 can be correct.</p>
申请公布号 JPH0945752(A) 申请公布日期 1997.02.14
申请号 JP19950191593 申请日期 1995.07.27
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MATSUSHITA MASANAO;SASADA SHIGERU;FUKUTOMI YOSHIMITSU
分类号 G01K1/14;G01K7/18;H01L21/027;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 G01K1/14
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