| 摘要 |
PROBLEM TO BE SOLVED: To apply resist uniformly by solving the problem of a warp caused by the dripped resist on an X-ray mask substrate formed with a thin film. SOLUTION: The X-ray mask 30 is vacuum champed to a head part 41. A thin film (m) is warped by dripping the resist on the part around the center of the X-ray mask 30, but the downward displacement of the height by the warp is measured by a displacement measuring means and fed back to a pressure regulator 55. The pressure regulator 55 gives necessary pressure to a hollow part E to cancel the displacement instantly. By pressurizing the hollow part E, the warp is removed and the displacement is canceled. When the head part 41 is rotated slowly, the resist on the X-ray mask 30 is spread to the circumference and the pressurized hollow part E tends to expand upward. In this case, the displacement of the height of the central part of the thin film (m) is measured by the displacement measuring means and the pressure regulator 55 controls the pressure of the hollow part E so that the height of the thin film (m) is always uniform. |
