发明名称 TERMINAL FOR INSULATING SUBSTRATE AND CONNECTING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a terminal for an insulating substrate and a connecting method thereof, in which a stable contact can be kept even when the insulating substrate is shrunk by heat, etc., at the time of the mounting with solder in the terminal for the insulating substrate, which is connected to the insulating substratefor an electronic component. SOLUTION: Strip irregular sections 19 are provided to cross the folding lines of the internal side faces of the leg sections 14, 16 of terminals 11A, 11B holding an insulating substrate 1 and to come in to contact with conductive films 4A, 4B on the surface of the insulating substrate 1, and the strip irregular sections 19 are made to bite into the conductive films 4A, 4B on the surfaces of the corner section of the insulating substrate 1 when the leg section 14, 16 are bent and caulked on the corner.
申请公布号 JPH0935902(A) 申请公布日期 1997.02.07
申请号 JP19950188882 申请日期 1995.07.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIMOTO TAKUMI;KATAOKA KENJI;MIURA MASATAKA;ONO KOJI
分类号 H01C1/01;H01R4/16;(IPC1-7):H01C1/01;H01R9/09 主分类号 H01C1/01
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