| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability by reducing a cross phenomenon by the reduction of input resistance and preventing a connection part from being broken by the reinforcement of an auxiliary substrate. SOLUTION: The mount structure consists of an FPC 5 which has metal, wiring, a display panel substrate 1 which has a display driving connection electrode, a semiconductor chip 7 which has an input projection electrode 8 and an output projection electrode 9 adhered to the metal wiring 6 and display driving connection wiring with conductive adhesives 10 over both the FPC 5 and display panel substrate 1, and an auxiliary substrate 3 which is backed over both the FPC 5 and display panel substrate 1 and reinforces the abutting parts of both. Then the auxiliary substrate 3 has an upper-stage part and a lower-stage part which are different in height because of a step; and the metal wiring 6 is adhered and fixed to the upper-stage part and the display driving connection electrode 2 is adhered and fixed to the lower stage part so that the both are almost in level with each other. |
