| 摘要 |
PROBLEM TO BE SOLVED: To prevent delamination by bonding a back electrode through a metal oxide to an insulating substrate thereby enhancing adhesion between them. SOLUTION: A glass substrate is employed as an insulating substrate 4 and a metal oxide layer 6 is formed tightly on the surface thereof. The metal oxide layer 6 is formed by sputtering a metal oxide on the surface of insulating substrate 4, for example. As compared with a metal film forming a back electrode 3, the metal oxide layer 6 exhibits high affinity to the insulating substrate made of plastic or glass and bonded strongly thereto. Furthermore, the metal film deposited on the metal oxide layer 6 to form the back electrode 3 is alloyed on the interface with the metal oxide layer 6 and bonded strongly. Since the metal oxide layer 6 is bonded strongly to both the insulating substrate 4 and the back electrode 3, the back electrode 3 is bonded strongly to the insulating substrate 4 and delamination on the interface can be prevented effectively. |
