CARRIER, SEMICONDUCTOR DEVICE, AND METHOD OF THEIR MOUNTING

摘要

A carrier and a semiconductor device having improved reliability, such as a heat cycle resistance, in mounting onto a circuit board. The semiconductor carrier (3) constituting the semiconductor device (1) includes recesses, on the bottoms of which external electrodes (8) are formed. With cream solder (13) filled into the recesses, the carrier is flipped and mounted on the circuit board (12). Heating is made at a temperature higher than the melting point of the cream solder (13).